Spring 2016 3DOT Goliath, Making Laser Tag Possible: Putting it all Together

April 18, 2016/in 3DoT Goliath, Communites, Goliath Generation #1, Members and Communities/by refaas0a

By: Kevin Moran (Electronics and Control Engineer), Tae Lee (Systems- Provided the musical notes code needed for this game)

In this post, I will be discussing the final results for the IR Emitter when being used alongside with a Schmitt Trigger and the code that will be used to determine when the 3DoT Rover gets hit 3 times by an IR emitter.

I will first show below what happens when this final circuit is connected to an Arduino analog pin, although the Schmitt trigger is technically used to convert an analog signal to digital, I feel it is important to understand these changes in analog first.

I first tested the output by connecting it to the Analog input of my Arduino Uno
The final output of the signal by using the correct resistors values has very little noise and it is controlled within our 0-5V range
When the IR light hits the receiver, the signal from the photo-transistor is passed by the Schmitt trigger. This trigger then inverts the signal, and reduces the noise from the input giving us the output shown here.

As can be seen this signal is inverted from the original IR receiver signal, and the final output has relatively zero noise.

Since this trigger is an analog to digital converter, I also decided to test the output with a digital Arduino pin.

I decided to test the circuit with an Arduino Digital Input (2) just to ensure if asked, the PCB would work with either analog or digital input.
The concept is the same, except the outputs are either 0v or 1v.
The signal in the output is different from the analog output, they are peaks.
As you can see from the Arduino plotter, the circuit detects the IR light faster, and counts more hits/second.

However upon closer inspection, I was told my output is not supposed to be spiked, but rather look similar to the analog output. One reason might be the Op-Amp I was told to use. I will continue testing and resolve this issue.

The Code:

This code is used to track the number of hits on the 3DoT Rover when testing with the analog pin. It consists of a loop that is activated once the voltage on the receiver reaches 3.5v, and counts the number of times it reaches this level or higher. Below I present the pseudo code and the flow chart in hopes of better explaining this code.

Flowchart:

Once the micro-controller detects 3 hits, it will play a short song and then reset, and start over again.

Sources:

https://www.arduino.cc/en/Tutorial/ReadAnalogVoltage

Spring 2016 3DOT Goliath, Making Laser Tag Possible: The emitter

April 18, 2016/in 3DoT Goliath, Communites, Goliath Generation #1, Members and Communities/by refaas0a

By: Kevin Moran (Electronics and Control Engineer)

In this post I will be discussing the IR emitter that is being used to make this game possible, and the components that go along with it:

Components:

IR LED: NTE30047

Transistor: 2N2222

Resistors: 8.6k and 110 ohm

The NPN transistor acts like a current regulator to ensure the IR LED is provided just enough current. The base which is connected to the 8.8k ohm resistor is connected to a digital pin on our micro-controller (3DoT or Arduino Nano) and this allows us to control when the emitter is on or off. The 110 ohm resistor is connected between the 5V supply and the positive side of the IR LED, while the ground is then connected to the collector.

This is the resistor value that allows us to use this NPN transistor as an on/off switch.

Fritzing Diagram:

Eagle CAD schematic:

Sources:

Jeffrey Cool: Division Manager

https://learn.sparkfun.com/tutorials/transistors

Spring 2016 3DOT Goliath, PCB Layout

April 18, 2016/in 3DoT Goliath, Communites, Goliath Generation #1, Members and Communities/by refaas0a

By: Jerry Lui ( Manufacturing Engineer)

The general layout of the PCB was determined by the how sensitive the signal was, the specific wiring of IC’s to surface mounted components, and mounted surface area. Power input was placed away from sensitive signals and had a trace width of 32mm @ 1oz/ft^2 copper thickness (determined by the PCB house/fabricator) with a total temperature shift of 10C which allows total current of 1A. The trace thicknesses can be quickly determined by the following chart:

While laying out the board make sure to perform a DRC error check frequently. The included .DRU error checking file has generic limitations which may or may not adequately represent your fabrication houses’ design requirements (EagleCAD will always flag drill and VIA holes). The fabrication house will generally supply a .DRU file that can be used in place and will often allow traces to be placed closer together.

All of the signals were moved as far from the power input as possible in this case I have placed on the top left corner. The large power supply capacitor was also placed as close as possible to the power input and the rest of the circuit was laid out to take power from that capacitor. Also, components were placed similarly to how they were wired in the schematic as much as possible so that they are generally easier to follow and understand.

Note that there are red dotted lines (and blue underneath) along the perimeter that represent the ground polygon which is needed to create the ground plane (red for top layer, blue for bottom layer). The isolation width (free space between the traces and ground plane) was set to 12mils by default but was changed to 16mils as a precaution. This value is mainly determined by the fabrication house limits.

To place a trace on the other side of the board while you’re currently laying a trace (top to bottom) click on the middle mouse button. This will automatically create a VIA (electrically connected through hole) that connects both traces.

TIP: If you don’t create a ground plane first you can right-click on any GND signal and hide it. This will reduce the air-wires shown so that laying out the PCB will be easier. All GND signals will be hidden with this option but can be restored by typing “ratsnest *” in the command line.

TIP: Component values can be hidden by disabling the tValues layer. This makes it significantly less cluttered.

In the picture below, the ground plane has been created by hitting the “ratsnest” command. Pay close attention to capacitors during the ground plane creation. The “relief” option should be enabled so that the negative terminal can actually be soldered easily; this option is set on by default.

The mounting holes seen above were created using VIA’s. The size is determined by what screw or mounting system that’s planned on being used. In this case the size was set to 86.6mils or the standard inner drill size of a M2 screw.

Text such as the label “Goliath spr’16” can be placed using the “text tool” and should be placed on the tPlace or bPlace plane. Make sure to properly label components and the positive terminal, negative/ground terminal or both.

This is what the board will look like after being fabricated from OshPark.

Conclusion

Laying out a PCB can be time consuming depending on the amount of components on your board. Never use auto routing as the algorithm used is not that great. Remember to account for trace thicknesses, pin locations, and temperature limits for components.

Spring 2016 3DOT Goliath, Making Laser Tag Possible: The Receiver

April 18, 2016/in 3DoT Goliath, Communites, Goliath Generation #1, Members and Communities/by refaas0a

By: Kevin Moran (Electronics and Control Engineer)

In this post I will be discussing my initial selection for the IR receiver and how I began testing its analog output.

Components:

Transistor: SFH 310 (Opto Semiconductor)

Resistor: 2M ohm

IR light

The phototransistor is a two legged transistor, with its third input being the output of the IR LED (Infrared Light).

When a light is shined, the electrons begin to diffuse from the emitter to the collector, this causes a voltage drop from its original 5V.
Unfortunately this signal is noisy and trying to use it directly for a game of laser tag would be very difficult. I present below the analog output of this transistor.

Arduino Plotter Graph:

Arduino Monitoring:

As can be appreciated from both the plotter and the monitor plots of the Arduino software, this analog signal is all over the place, the voltage drops varies depending on the distance of the LED from the receiver, and the length of time the light actually hits the receiver. Playing a game of laser tag with these results would not be very appropriate. The noise levels when no IR light is hitting the receiver are also shown on the Arduino plotter graph.

Note: The resistor value of 2M was chosen based on testing the sensitivity of the receiver with various values. 2 mega ohms turned out to be the best result

The code:

To read the analog voltage output

Eagle Cad Schematic:

Sources:

Jeff Cool: Division Manager

https://www.arduino.cc/

https://learn.sparkfun.com/tutorials/transistors

Spring 2016 3DOT Goliath, Making Laser Tag Possible: The Schmitt Trigger

April 18, 2016/in 3DoT Goliath, Communites, Goliath Generation #1, Members and Communities/by refaas0a

By: Kevin Moran (Electronics and Control Engineer)

Since the analog output of the receiver is very noisy, my division manager suggested I use a Schmitt trigger which has 2 jobs:

It reduces noise from the circuit through hysteresis, the time-based dependence of a system’s output on present and past inputs.
It inverts the signal from the detector circuit and creates two thresholds-high and low. By changing resistor values we are able to control the high and low thresholds.

Below is the graph of a generic output using the Schmitt Trigger, as can be seen the signal is inverted, and the noise is relatively gone.

Now the challenge was selecting the correct Schmitt trigger that would work best with our receiver, after testing various resistor values, I made my choice between two sets of resistors.

I decided to go with the resistor values from Trigger 1, because It has a larger gap between the high and the low thresholds. When tested with the Phototransistor it provides a low threshold closer to 0 voltage

All values were taken with multi meter while changing the input voltage

Note: The high and low threshold change when the Resistor value connecting the receiver is changed from 100k ohms to 2M ohms (I did this in order to increase the sensitivity of the receiver)

Testing with Arduino Monitor:

When light is applied to the photo-transistor and the input is placed through the Schmitt trigger
- High Voltage= 3.76 V
- Low Voltage= 0.02 V

In order to make the phototransistor sensitive enough to be able to detect the IR light, I am using a 2 mega ohm resistor from the detector to the 5v supply

Both the high and low voltage thresholds are shown using the Serial Monitor

This is the result.

I also conducted a test on the Schmitt Trigger using a potentiometer

Components for this test:

10k potentiometer

LM358 Op-Amp

Resistors: 100k, 51k, 51k

Capacitors: 10 microF

Arduino Uno

The threshold between a high or low input from this test is 2.6V

As I varied the resistance in the potentiometer I obtained the graph provided in this slide

Based on this experiment I concluded that my Schmitt trigger was ready to be used alongside the photo-transistor.

Below is the result from this test using both the Arduino plotter and monitor

As can be seen again, a very clean signal that has only two outputs a low 0.02v and a high at 3.78v

Sources:

Jeffrey Cool: Division Manager

http://www.ti.com/lit/an/scea046/scea046.pdf

http://pcbheaven.com/wikipages/The_Schmitt_Trigger/

Spring 2016 A-TeChToP Seizure Watch PCB Layout

April 18, 2016/in A-TechTop Generation #4, A-TeChToP Wednesday/by A-TeChToP

By Marena William (Manufacturing Engineer)

Overview

The 3D printed housing of the seizure watch will contain the PCB board which consists of the EDA sensor, accelometer, clock and the ATSAMB11. The electrodes’ wires will be connected to the EDA connector. Eagle CAD software was used to generate the PCB schematic and layout.

Spring 2016 3D SMD: Verification Test Plan

April 18, 2016/in 3D SMD/by BaoDoan

By: Christine Vu (Missions, Systems, and Test)

Table of Contents

Purpose

Verification Tests will be conducted to verify the requirements based on the Verification Matrix.

Requirements for Verification Tests

Section 1 EE400D Assembly

The SMD pick and place machine shall pick up and place down all SMT components provided by any EE400D PCB up until the end of Spring 2016.

Section 1.1

Working area must be within 12.2”x15.35”(310mmx390mm) based on the Makeblock X-Y

Plotter Robot Kit.

Section 1.1.2

Surface to hold PCB shall be smooth with dimensions tolerances to be ±.001″, parallelism to .001″, and flatness to .001″ (TCI Precision, 2005).

Section 1.1.3

All pick and place processes shall begin at the bottom left corner of the PCB.

Section 1.1.4

All wires using RJ25 connectors shall have a minimum bend radius of 4x its diameter (Telecommunications Industry Association, 2001).

Section 1.2

Pick and place SMD machine shall change the orientation of each SMT component before placement.

Section 3 Software Design

Software for the SMD pick and place shall accept all EAGLE PCB files of EE400D projects up until Spring 2016.

Section 3.1

Software shall translate all EagleCAD files from EE400D PCB’s to G-Code files.

Section 3.1.1

Software shall include all x-, y-, and z-coordinates for SMD pick and place machine to read.

Section 4 Reel Feeder Design

The SMD pick and place machine shall have four 8mm reel feeders and one IC tray.

Section 4.1

All SMT resistors and capacitors shall remain in cut-tape of the reel feeders until the vacuum nozzle is ready to pick up the component.

Section 4.1.1

All reel feeders shall be installed on the working area, 12.2”x15.35”(310mmx390mm).

Section 4.1.2

Bracket to hold cut-tape of the reel feeders shall be higher than 0.04″.

Section 4.1.3

All motors used to peel off cut-tape of reel feeders must rotate 360°.

Section 4.2

IC tray shall store all IC chips required for one PCB assembly.

Section 4.2.1

IC tray shall be installed within working area, 12.2”x15.35” (310mmx390mm).

Section 5 Vacuum Head Design I

SMT component size 0402 shall be the smallest component that the pick and place SMD

machine can pick up.

Section 5.1

Vacuum system shall be able to pick up all SMT components as small as size 0402.

Section 5.1.1

Vacuum nozzle shall be smaller than 0.02″ ± 0.002″.

Section 6 Vacuum Head Design II

ATmega32u4 chip shall be the heaviest component that the pick and place SMD machine can pick up.

Section 6.1

Vacuum suction pad shall be smaller than 0.4″ ± 0.01″.

Summary of Verification

Verification tests will be conducted to reflect the requirements on the physical design of the SMD pick and place machine. A list of procedures will be presented in this document followed by the results and conclusion.

Verification Matrix

** Updated 4/29/16: Added new requirement section to consider the heaviest chip can be picked up. Dimension limitations were based on Atmel’s datasheet (2016).

List of Equipment

Applicable tools and software will be listed for each Verification test.

Verification Tests

EE400D Assembly

Working Area Test

Working area is defined by the area that includes PCB to assemble, reel feeders, and IC tray. To verify that our design meets the size criteria for working area, a test will be conducted to calculate its parameters.

Requirements

Section 1 EE400D Assembly

The SMD pick and place machine shall pick up and place down all SMT components provided by any EE400D PCB up until the end of Spring 2016.

Section 1.1

Working area must be within 12.2”x15.35”(310mmx390mm) based on the Makeblock X-Y

Plotter Robot Kit.

Section 1.1.2

Surface to hold PCB shall be smooth with dimensions tolerances to be ±.001″, parallelism to .001″, and flatness to .001″ (TCI Precision, 2005).

Section 1.1.3

All pick and place processes shall begin at the bottom left corner of the PCB.

Section 1.1.4

All wires using RJ25 connectors shall have a minimum bend radius of 4x its diameter (Telecommunications Industry Association, 2001).

Section 1.2

Pick and place SMD machine shall change the orientation of each SMT component before placement.

Applicable Tools

Equipment Type	Name (Brand)	Tolerance
Mitutoyo S/N 12519090	Caliper	0.001”
Measuring Tape	Stanley 33-425 Powerlock 25-Foot by 1-Inch Measuring Tape	+/- 3%

Procedure

Record the weight of the heaviest component.
Calculate the required minimum diameter of the vacuum nozzle that the heaviest can be picked up.
Test and measure the pressure.
Attach the Z-Axis with pen attachment to the X-Y Plotter.
Create an EAGLE PCB design by placing capacitors on each corner of the design. A free EAGLE version would allow 4” x 3.2”.
Convert to GCode and send to Makeblock X-Y Plotter.
After the sketch, measure the dimensions of the EAGLE PCB design.

Cable Test

A test will be conducted to determine that the bending radius will not exceed a bend radius of 4x its radius.

Applicable Tools

Equipment Type	Name (Brand)	Tolerance
Mitutoyo S/N 12519090	Caliper	0.001”

Procedure

Connect the wires attached to the X-Axis and Y-Axis.
Control the Y-Axis and move to the farthest end of the plotter with respect to the PCB until the limiting switch is hit. Record the length of the cable.
Control the Y-Axis to the other side of the limiting switch. Record the bend radius as shown as the photo below.

Figure 1. (Wikipedia, 2007).

Product Competitiveness

Objective

To verify that our SMD pick and place machine is designed similar to an industrial machine, a test will be conducted to determine the precision of the SMT component placement.

Requirements

Section 2 Project Competitiveness

The SMD pick and place machine shall be modified from an XY Plotter to have the same error specification of Madell Corporation Model DP2006-2 (n.d).

Section 2.1

Makeblock XY Plotter motors shall be modified to pick and place with 0.002″ error tolerance.

Section 2.1.1

Resolution of all axes motors shall be less than 1.8°/step.

Section 2.1.2

Z-axis motor shall move the vacuum system at 90° with respect to the floor.

Applicable Tools

Equipment Type	Name (Brand)	Tolerance
Mitutoyo S/N 12519090	Caliper	0.001”

Procedure

Record the length of the SMT component.
On PCB, measure the distance between the centers of the capacitor/resistor pads. Record.
Operate the pick and place machine by picking and placing the SMT component.
Measure the distance between the SMT component pin and the pads.

Software Design

Objective

To verify Software design, a test will be conducted to verify the process of converting an EAGLE file to GCode in order to send it to the modified Makeblock X-Y Plotter Robot Kit to move. The Z-axis software will be modified to control as if it was an X-axis and Y-axis.

Requirements

Section 3.1.1

Software shall include all x-, y-, and z-coordinates for SMD pick and place machine to read.

Applicable Tools

GRemote Graphic User Interface (GUI)

Notepad++ Application

Equipment Type	Name (Brand)	Tolerance
Mitutoyo S/N 12519090	Caliper	0.001”

Procedure

A test for the X-axis and Y-axis motors have been conducted previously given an EAGLE file from G-Code.

https://www.arxterra.com/spring-2016-3d-smd-conversion-of-eagle-file-to-gcode-initial-process/

Set-up Z-axis movement by attaching stepper motor to Z-axis structure.
Connect stepper motor to Me Stepper Driver. Set switches to H H L (⅛ steps).
Connect corresponding Me Stepper Driver to Port 10.
Plug in Me UNO Shield and turn on switch to provide 12 V to stepper motor.
Zero out Z-axis on GRemote GUI by entering “G92”.
Measure initial height of Z-axis structure to the nearest 0.001 inches.
On GRemote GUI, enter “Z100”.
Wait until stepper motor stops running and measure the final height of the Z-axis structure to the nearest 0.001 inches.

“Z100” is a command that tells the Z-axis structure to move 100 mm when the Me Stepper driver is H H L. This procedure we will confirm the height difference of the Z-axis.

Reel Feeder Design

Objective

To verify the reel feeder design has the correct function, a test will be conducted to determine its parameters and design.

Requirements

Section 4

The SMD pick and place machine shall have four 8mm reel feeders and one IC tray.

Section 4.1

All SMT resistors and capacitors shall remain in cut-tape of the reel feeders until the vacuum nozzle is ready to pick up the component.

Section 4.1.1

All reel feeders shall be installed on the working area, 12.2”x15.35”(310mmx390mm).

Section 4.1.2

Bracket to hold cut-tape of the reel feeders shall be higher than 0.04″.

Section 4.1.3

All motors used to peel off cut-tape of reel feeders must rotate 360°.

Section 4.2

IC tray shall store all IC chips required for one PCB assembly.

Section 4.2.1

IC tray shall be installed within working area, 12.2”x15.35” (310mmx390mm).

Applicable Tools

Hardware:

Reel Feeder

Micro Servo FS-90

Equipment Type	Name (Brand)	Tolerance
Mitutoyo S/N 12519090	Caliper	0.001”

Procedure

Note: Photos will be attached and documented

Install reel feeder to the aluminum surface. Attache reel with SMT components.
Install the IC tray to the working area.
Install micro servo to reel feeder bracket. Servo wheel shaft shall be placed at an angle of approximately 45°. Record Servo wheel angle.
Attach Z-axis and move the X-Y-axis motors to a component. Measure the clearance around the Z-axis. Record the clearance tolerance, which includes the distance around both the reel feeder and IC tray. Measure the height of the IC tray.
Operate the micro servo by turning 360°. This requires timing of the speed of the micro servo and must be determined in the Arduino Code. Record this time.
Determine initial measurement of the reel on the reel feeder. Record this measurement
With the cut-tape attached to the micro servo wheel shaft, reel in the cut-tape. The SMT components counteract this force by moving back.
Observe the elevation of the reel feeder. Record the height of the reel feeder.
Record the distance of the SMT components traveled.

Results Template

Angle of Servo Shaft

Z-Axis Front (in.)

Z-Axis Left side (in.)

Z-Axis Right side (in.)

Z-axis Height

Vacuum Head Design

Vacuum Head Test

To verify the size of the vacuum nozzle design, a test will be conducted to determine that the size of the vacuum provides sufficient pressure to pick up an SMT component.

Requirements

Section 5 Vacuum Head Design

SMT component size 0402 shall be the smallest component that the pick and place SMD

machine can pick up.

Section 5.1

Vacuum system shall be able to pick up all SMT components as small as size 0402.

Section 5.1.1

Vacuum nozzle shall be smaller than 0.50 ± 0.05 mm.

Section 5.1.2

A solenoid valve for vacuum system shall keep a stable temperature under 160° F during Operation.

Section 6 Vacuum Head Design II

ATmega32u4 chip shall be the heaviest component that the pick and place SMD machine can pick up.

Section 6.1

Vacuum suction pad shall be smaller than 0.4″ ± 0.01″.

Applicable Tools

Equipment Type

Name (Brand)

Tolerance Level

Pressure Gauge

Milton S921

http://www.acmetools.com/shop/tools/milton-s921

+/- 2 psi

Procedure

Determine actual mass of desired 0402 SMT component. Record under SMT component mass column.
With a T-bracket, measure the pressure by connecting both ends of the vacuum tubing and pressure gauge.
Turn on vacuum pump and measure pressure. Record the value under pressure column.
Calculate the minimum required diameter using the equation below.
Measure the diameter of the vacuum nozzle being used. Using the equation below, plug in the diameter size and calculate the maximum mass allowed.

Equation 1. Obtained from (VMeca, n.d.).

Solenoid Valve Test

The purpose of this document is to verify that the solenoid valve can be used to control the the airflow of the vacuum system without overheating or damage to the vacuum tubing. Increased heat would affect the pressure within the tubing, thus could lead to errors in the operation of the pick and place machine.

References

Aquarium airline tubing is a Tuyau Standard type, which was found to operate at a temperature range of 86 ° F – 176° F (PennPlax, n.d. & Festo, 2016.)

Applicable Tools

Equipment Type	Name (Brand)	Tolerance Level
Thermometer Gun	Fluke 561 Infrared and Contact Thermometer http://en-us.fluke.com/products/thermometers/fluke-561-thermometer.html#techspecs	±0.5% of reading or ±1°C (±2°F), whichever is greater
12 Vdc Voltage Supply	Makeblock Motor Pin connection provides approximately 12 Vdc.	N/A
Multimeter	Extech MN35 Mini Multimeter http://www.amazon.com/Extech-MN35-Digital-Mini-MultiMeter/dp/B0012VWR20	0.5 %

Preliminary Calculations

We will estimate how many times the solenoid valve should close when placing one part. We would have to time when the solenoid valve should open and close.

Close at PCB (discrepancy may be involved because the PCB locations vary, and the origin will be ignored because it will only be at the origin once. For the ease of this experiment, the opening and closing of the solenoid valve shall be at a minute by minute basis as shown in the calculations)
Open at Reel Feeder
Close back at PCB

Therefore, for one part to be placed, the solenoid valve must operate in 3 steps. The SMD pick and place machine estimates an assemble rate of 200 parts per hour.

200 parts/hour * 3 steps/part = 600 steps/hour

Convert to minutes:

600 steps/hour * 1 hour/ 60 minutes = 10 steps/minute

During our experiment, we will need to open and close the solenoid valve 10 times every minute.

Test Procedures & Criteria

Connect the solenoid valve to operating voltage 12 Vdc. Solenoid valve should be open.
Open and close the solenoid valve 10 times per minute for one hour.
Every ten minutes, record the temperature of the barbed fitting hose. If the temperature goes higher than 176°F, turn off. (Tip: The temperature gun should record the temperature at the same area and distance to be consistent.)
Measure and record the temperature of the solenoid valve to confirm that it is under 176°F +/- 10°F. under “Actual Final Temperature”.
Cool the solenoid valve to room temperature and repeat one more time.

References

Atmel Corporation. (2016). ATmega16U4/ATmega32U4.

URL: http://www.atmel.com/images/atmel-7766-8-bit-avr-atmega16u4-32u4_summary.pdf

Festo. (2016). Plastic Tubing, Standard O.D.

URL: https://www.festo.com/cat/en-gb_gb/data/doc_ENGB/PDF/EN/OD-TUBING_EN.PDF

PennPlax, n.d. Aquarium Decorations Betta Accessories Maintenance.

URL: http://www.pennplax.com/pennplax%20pdf/Aquarium-Decorations-Betta-Accessories-Maintenance.pdf

Vmeca, n.d. How to select the proper vacuum pump.

URL: http://www.servikatalogen.no/Katalogdata/pdf/200802-1-2-3.pdf

Wikipedia. (2007). Image of a Cable with Seven Meter Radius.

URL: https://en.wikipedia.org/wiki/Bend_radius#/media/File:Bendradius.svg

Yadav, A. , Mehta, S. , Sawant, S. , Pujari, C. , & Chaudhary, M. (2014). Pick and place robotic

system for assembly of thermostat radiator valve.International Journal of Engineering

Trends and Technology, 11(3), 111-113.

Spring 2016 A-TeChToP Central Sensor Suite PCB Layout

April 17, 2016/in A-TechTop Generation #4, A-TeChToP Wednesday/by A-TeChToP

By Mimy Ho (Manufacturing Engineer)

Overview

The chest harness prototype of the central sensor suite will have the 3D printed case which contains a printed circuit board and a 9V battery. The PCB includes the Arduino Pro Mini, accelerometer, temperature sensors, ECG circuitry, pulse oximeter circuitry. The PCB supports and electrically connects all the sensors to the Arduino Pro Mini. The schematic and layout were generated by Eagle CAD software.